Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV

The Chinese Academy of Sciences' Institute of Microelectronics has achieved a breakthrough in 3nm GAA technology without relying on EUV lithography, marking a critical step toward self-reliance in advanced semiconductor manufacturing. This development reshapes the global supply chain, pressuring leading players like TSMC and Samsung to accelerate non-EUV route exploration. From a compliance standpoint, while this reduces reliance on restricted technologies, it still faces challenges in equipment and material dependencies. In the market, this advancement accelerates domestic substitution, especially in high-end chip design, pushing more firms toward autonomous tech strategies. Over the next 12-24 months, if mass production is realized, it could significantly enhance China’s global influence in advanced manufacturing and prompt further shifts in international semiconductor policies.