Exclusive: China's 8-inch SiC suppliers turn to pricing discipline after 6-inch price war

The shift from 6-inch to 8-inch SiC wafer production signals a major technological evolution in the industry. Leading substrate suppliers are tightening pricing and customer selection criteria to protect margins, learning from the brutal price war that devastated the 6-inch market. This move will accelerate downstream device manufacturers to adopt 8-inch processes, improving yield and capacity utilization. From a policy perspective, government support for semiconductor self-reliance increases supply chain security concerns, but also raises operational costs for companies. Competitors may respond through technology licensing or M&A to secure 8-inch capacity advantages. Over the next 12-24 months, the SiC market will see structural divergence, with leading firms dominating through technical moats and cost control, while smaller players face attrition. This adjustment reflects broader global semiconductor supply chain realignment, as Chinese companies transition from price competition to value-driven strategies.