Eternal Precision Mechanics accelerates advanced packaging push with wafer lamination - digitimes

Eternal Precision Mechanics (EPM), a fast-growing subsidiary of Eternal Materials, is accelerating its transition from IC substrates to advanced packaging equipment with the introduction of wafer lami... Read original →

EPM’s adoption of wafer lamination technology marks a strategic pivot from IC substrates to advanced packaging equipment, catalyzing upstream supply chain upgrades in materials and automation. This shift intensifies demand for high-precision adhesives, alignment systems, and control modules, reshaping equipment supplier dynamics. From a compliance standpoint, the advancement may escalate geopolitical tensions, particularly under export controls on advanced packaging tech, raising operational costs and supply chain vulnerabilities. Competitors like TSMC and Amkor are likely to accelerate their own R&D efforts to maintain market dominance. Over the next 12 to 24 months, as AI, IoT, and autonomous driving drive demand for high-performance chips, advanced packaging will become a core growth axis. EPM’s ability to scale production quickly will determine its competitive positioning in this emerging segment.