Doosan thins memory-package CCL insulation to 13µm

Doosan's advancement in reducing CCL insulation thickness to 13µm marks a pivotal shift toward ultra-thin packaging in memory semiconductors. This innovation directly pressures upstream material suppliers to enhance precision, particularly in copper foil and PPG layers. From a geopolitical standpoint, it intensifies competition between Taiwan, China and South Korea/Japan in high-end materials, affecting major players like TSMC and Samsung. If mass production proceeds, it will compel memory chip designers to adopt more compact packaging, accelerating integration trends. In the short term, material pricing may fluctuate; in the long term, this could reshape the global packaging substrate supply chain, especially for import-dependent manufacturers. Within 12 months, similar advancements are expected to penetrate AI and high-performance computing chips, pushing packaging technologies into micro-meter limits.