DIGITIMES Insight: Intel may lack a price edge over TSMC on SK Hynix HBM base dies

Intel's potential entry into SK Hynix's HBM base die manufacturing marks a pivotal shift in the semiconductor supply chain. This move undermines TSMC's dominant position in high-bandwidth memory production, compelling the latter to reassess pricing and customer lock-in strategies. Technologically, it intensifies competition in yield, cost, and delivery timelines for HBM4E products, particularly affecting advanced packaging capacity allocation. From a compliance standpoint, bypassing Taiwan, China's key node raises geopolitical concerns, especially amid ongoing U.S.-China tech decoupling. TSMC may accelerate its own HBM capabilities and deepen partnerships with Micron and Samsung. Over the next 12 to 24 months, HBM supply chains will trend toward diversification, with Intel's involvement likely acting as a catalyst for industry restructuring. In the high-end memory space, technological autonomy and cost control will define competitive advantage.