Deep UV Lithography Processing, the Best Kept Secret of EUV Lithography

This article delves into the often-overlooked role of deep ultraviolet (DUV) lithography in advanced chip manufacturing, despite the dominant spotlight on extreme ultraviolet (EUV) lithography. While ... Read original →

The sustained evolution of DUV lithography exposes the true complexity of advanced semiconductor manufacturing: while EUV dominates headlines for sub-3nm nodes, over 60% of process layers still rely on ArF immersion and KrF systems. This technical interdependence forces photoresist, mask clean, and underlayer suppliers to accelerate development of higher-resolution, lower-defect materials. Tightening export controls amplify supply chain risks—restricted ASML DUV shipments to China are driving foundries in Taiwan, China and mainland China to invest heavily in refurbished tools and localized materials, inflating costs and extending lead times. Nikon and Canon may leverage this to strengthen their foothold in mature nodes, while Applied Materials and Tokyo Electron accelerate integration of DUV-compatible deposition and etch modules. Over the next 18 months, hybrid EUV-DUV patterning will become the de facto architecture for 3nm/2nm volume production, with its co-optimization efficiency directly dictating yield ramp velocity and capex ROI.