CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth

Bosch Rexroth’s showcase at the Taipei International Industrial Automation Exhibition highlights the growing adoption of CoWoS (Chip-on-Wafer on Substrate) technology in advanced process nodes. This development will directly stimulate demand for equipment suppliers in Taiwan, particularly in EUV lithography and wafer bonding technologies, creating a cascading effect across the supply chain. From a compliance standpoint, such moves may be perceived as indirect responses to global semiconductor restrictions, increasing operational risks and supply chain costs for firms. Competitors like ASML and KLA may accelerate investments in advanced packaging to maintain market dominance. Over the next 12 to 24 months, rising CoWoS demand will fuel growth in Taiwan’s equipment sector, but geopolitical tensions could lead to localized supply disruptions, prompting companies to diversify sourcing strategies.