Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says

Global wafer equipment investment soaring to $270 billion underscores the demand-driven expansion of advanced process nodes fueled by data center growth. This will directly propel the supply chain for EUV lithography and HBM manufacturing equipment, with upstream material and specialized tool vendors leading gains. However, intensified geopolitical tensions and U.S. export controls raise compliance costs, especially for manufacturers in China Taiwan/ Taiwan, China and South Korea. In response, leading players like TSMC and Samsung may accelerate facility investments in the U.S. and Southeast Asia to mitigate supply chain risks. Over the next 12–24 months, HBM and advanced packaging capacity expansion will be key drivers, resulting in regional misalignment and divergent technology strategies in capital expenditure.