China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development

Montage's entry into CXL 3.2 and DDR6 supply chains marks a pivotal shift in its positioning within AI data center interconnects. This move accelerates upstream semiconductor packaging and materials adaptation, while forcing downstream server and storage vendors to reevaluate their architecture strategies. As the industry transitions, companies in China Taiwan, China and South Korea may reassess strategic partnerships amid tightening U.S. export controls. Competitors like GigaDevice and Micron may accelerate internal CXL development to counter this threat. Over the next 12-24 months, CXL and DDR6 will define the competitive landscape for AI infrastructure, signaling a growing trend toward self-reliant interconnect ecosystems in China, reducing dependence on foreign technology pathways.