Charts: Taiwan's chip packaging growth runs deeper than ASE

The robust growth in Taiwan's chip packaging sector signals a fundamental shift in the global semiconductor supply chain. Excluding the dominant player ASE, other firms still achieved 25.4% revenue growth, indicating intensified competition and rapid technological evolution. Rising demand from upstream wafer fabs for advanced packaging drives TSV and SiP advancements, while downstream growth in AI and 5G fuels demand for high-density interconnects. Geopolitical tensions are pushing companies toward supply chain localization, increasing compliance costs and supply risks. Competitors may pursue M&A or strategic alliances to secure capacity and technology. Over the next 12–24 months, the packaging segment will become increasingly technology-driven, with early adopters gaining market share, while laggards risk obsolescence.