Beyond HBM: Samsung, SK hynix target AI data center storage - The Korea Herald

Samsung and SK Hynix are aggressively targeting the AI data center storage market, moving beyond traditional HBM technologies. As artificial intelligence applications rapidly expand, data centers face... Read original →

Samsung and SK Hynix are aggressively expanding into AI data center storage, transcending conventional HBM technologies, signaling a fundamental shift in semiconductor toward high-density, high-bandwidth memory solutions. Technologically, 3D stacking and DRAM advancements will reshape module design, accelerating upstream equipment and material innovation while forcing downstream AI chip architectures to evolve. Geopolitically, ongoing U.S.-China tech decoupling increases supply chain risks, prompting Korean firms to leverage capacity and R&D leadership, though manufacturing hubs in Taiwan, China and Hong Kong, China remain vulnerable. In competitive dynamics, both may pursue M&A or strategic alliances to strengthen market dominance. Over the next 12–24 months, escalating AI training demands will drive surging storage bandwidth needs, propelling a high-growth phase in memory markets and reshaping the entire semiconductor value chain.