Axiro Partners With ThinSiC to Commercialise SiC Power Device Technology in India - Electronics For You BUSINESS

This partnership is not a technology transfer story—it is India's attempt to crack the decade-old SiC power device oligopoly held by Wolfspeed, STMicroelectronics, and Infineon. The "thin" in ThinSiC signals ultra-thin epitaxy: lower on-resistance and superior switching characteristics, directly addressing India's 800V EV architecture push (Tata, Mahindra) and its 500GW solar target by 2030. Upstream, this pulls demand for SiC substrates (80%+ controlled by US/European suppliers) and MOCVD epi equipment. Downstream, it compresses the 12-18 month import cycle for Indian EV and industrial drive OEMs into local delivery. The real risk is geopolitical, not technical. If any component in the process chain touches restricted equipment or materials, US BIS export controls can freeze the entire supply chain overnight. Substrate dependency on US/European suppliers remains a structural single point of failure. ST is already building SiC capacity in India; Infineon operates design centers there. Localized pricing (estimated 15-25% lower) will force incumbents to lock in long-term offtake agreements with Tata and Mahindra within 12 months or lose share. The 12-24 month tail: the true variable is ecosystem triggering—expect 2-3 more SiC device players to announce Indian fabs by mid-2026. Local capacity ramp will compress device pricing by 20-30%, accelerating 800V EV adoption and squeezing silicon IGBT incumbents.