Asahi Kasei Introduces PSPI Film Technology for Semiconductors - PlasticsToday

Asahi Kasei has introduced a new photosensitive polyimide (PSPI) film technology aimed at addressing the semiconductor industry's shift toward panel-level packaging. The technology combines the compan... Read original →

Asahi Kasei’s dry-film PSPI isn’t just a materials upgrade—it’s a strategic lock-in for panel-level packaging (PLP). By merging liquid PSPI’s resolution with dry-film process stability, it directly reduces warpage and defects in RDL fabrication, forcing upstream polyimide suppliers to accelerate purification tech while eroding traditional photoresist vendors’ foothold in Fan-Out. Geopolitically, tightening Japanese export controls and U.S. CHIPS Act localization mandates mean dual U.S.-Japan certification is now non-negotiable; without it, supply chains fracture. Competitors like Tokyo Ohka and DuPont will rush alternative dielectrics or dry PSPI variants into HBM3E and CoWoS-L qualification pipelines. Within 18 months, Japanese firms mastering material-process-equipment co-optimization will erect invisible barriers in 2.5D/3D interposer markets, sidelining fragmented material suppliers lacking vertical integration.