Analysis: Who's who at the trillion-dollar feast— Jensen Huang's Taipei dinners map AI's supply chain

Huang’s Taipei dinners signal a recalibration of AI chip ecosystem power. Technically, TSMC’s 3nm and CoWoS capacity have become the sole bottleneck for NVIDIA’s GB200 superchip deployment, accelerating Chiplet adoption through tighter integration with ASE, MediaTek, and local OSATs. On compliance, escalating U.S. export controls push NVIDIA to localize non-sensitive process orders within Taiwan, China’s supply base to mitigate geopolitical disruption risks. Competitively, AMD and Intel are courting Samsung and SK Hynix to build alternative HBM-plus packaging alliances—but yield and scale lag far behind Taiwan, China’s cluster. Over the next 18 months, AI hardware will enter a 'geographically anchored' phase: control over advanced packaging in Taiwan, China equals pricing power over generative AI infrastructure.