Analysis: China's 15th five-year plan spotlights diamond for AI chip thermal management

The inclusion of synthetic diamond in China's 15th Five-Year Plan signals a strategic push toward advanced thermal management for AI chips. This move catalyzes adoption of GaN and diamond-composite materials in power electronics and RF modules, benefiting upstream suppliers of SiC and MOCVD equipment. As policy tightens, supply chains will shift toward localization, raising compliance costs. Global players like Infineon and Qualcomm may adjust investment strategies or seek partnerships to mitigate exposure. Within the next 12 months, thermal management materials will undergo rapid innovation, with diamond substrates emerging as a key bottleneck in high-end packaging. Industry consolidation is expected to accelerate.