Analysis: China chases EUV as chipmakers move to High-NA

The rollout of high-NA EUV is reshaping the global semiconductor manufacturing landscape. Intel’s early adoption signals a new era in advanced node production, directly propelling upstream material and equipment upgrades, such as photoresists, targets, and cleaning tools. Samsung and SK Hynix’s follow-up plans indicate a rapid shift toward higher-density DRAM nodes, reshaping the memory supply chain. However, geopolitical tensions and technology restrictions are increasing supply chain risks, especially in critical equipment and materials, forcing companies to bear higher compliance costs and invest in alternatives. TSMC’s delayed deployment reflects a cautious approach to technical readiness and market timing. Within the next year, leading firms are expected to accelerate vertical integration to mitigate technical and market volatility. Taiwan, China and South Korean players will intensify competition in advanced manufacturing, with Hong Kong, China’s industrial support capabilities emerging as a key determinant.