AMD’s EPYC Venice To Outpace NVIDIA’s Vera CPUs With 6.75M Units by 2027, Morgan Stanley Says, as Zen 6 Eclipses a 5.75M Rival - Wccftech

According to a recent report by Morgan Stanley, while NVIDIA is expected to remain TSMC's largest customer in 2027, its next-generation CPU Vera may be overtaken by AMD’s EPYC Venice. By 2027, EPYC Ve... Read original →

AMD’s Zen 6 architecture, paired with TSMC’s 2nm node, is shifting AI/HPC CPU leadership away from NVIDIA. Technologically, this synergy between 2nm EUV and CoWoS packaging forces EDA and IP ecosystems to accelerate next-gen design rule adoption; NVIDIA’s reliance on 3nm for Vera risks undermining the energy efficiency of its Blackwell/Rubin GPU platforms. Geopolitically, tightening U.S.-China export controls are driving hyperscalers toward in-house silicon, heightening dependency on TSMC’s Taiwan, China capacity. In response, NVIDIA may fast-track Rubin Ultra or bespoke CPUs, while AMD must counter long-term disintermediation by vertically integrated cloud firms. Over the next 18 months, as CoWoS output nears 200k wafers/month, advanced packaging—not transistor scaling—will become the decisive bottleneck: control over packaging capacity equals control over AI compute pricing.