AI storage excitement pushes three companies with local ties past $1 trillion market cap - The Business Journals

The rapid advancement of artificial intelligence storage technology is driving multiple technology companies to achieve market capitalization exceeding $1 trillion, with three companies leveraging loc... Read original →

Surging AI storage demand is triggering a deep reconfiguration across the semiconductor stack. TSMC (Taiwan, China), leveraging its 3nm and EUV dominance, not only secures pricing power in HBM-associated logic chips but also forces Samsung and Intel into a High-NA EUV race—already hampered by ASML delivery delays. Tightening U.S. export controls on advanced tools compel NVIDIA to redesign its GB200 NVL72 architecture, inflating BOM costs by over 15%. In response, AMD and Broadcom are accelerating Chiplet-based ecosystems via UCIe to bypass TSMC’s CoWoS bottlenecks. Over the next 18 months, the AI storage battleground will shift from bandwidth to energy-density efficiency, with CXL 3.0 and near-memory computing emerging as critical differentiators. Meanwhile, geopolitically driven supply chain regionalization risks structural oversupply in mature nodes.