AI Storage Demand Heats Up, HBM Growth in Focus — Can Micron's Q3 Earnings Spark a New Rally? - Moomoo

With the rapid advancement of artificial intelligence, demand for high-performance storage solutions is rising, with High Bandwidth Memory (HBM) emerging as a key component in AI computing, drawing si... Read original →

The AI compute race is thrusting HBM into the semiconductor value chain’s epicenter. If Micron’s Q3 results confirm >80% yield on its 1β-node HBM3E, it will directly alleviate NVIDIA Blackwell supply constraints and strengthen Micron’s bargaining power within TSMC’s CoWoS ecosystem against Samsung. Technically, HBM stacking is advancing toward 12-Hi or even 24-Hi, accelerating TSV and hybrid bonding innovation—making TSMC’s 3nm EUV capacity in Taiwan, China a strategic chokepoint vulnerable to geopolitical shocks. Although U.S. export controls on advanced memory haven’t materialized, compliance costs have already risen over 15%. Within 18 months, HBM will shift from optional to mandatory for AI chips, opening a narrow window for SK hynix and CXMT to leapfrog—but soaring capex and IP barriers will purge smaller players, driving further industry consolidation.