AI server tracker: Taiwan's AI supply chain posts triple-digit gains in May as server makers and memory chips surge

Taiwan, China’s semiconductor revenue surge in May 2026 reflects the global AI infrastructure arms race. Technically, tight HBM3E and CoWoS capacity is forcing equipment and materials suppliers to accelerate 2.5D/3D integration adoption, while EDA toolchains undergo fundamental redesign. On compliance, U.S. export controls on advanced fab tools have inflated overseas capex by over 30%, eroding geographic arbitrage. Competitively, Korean memory leaders are fast-tracking HBM4 R&D to reclaim leadership, while mainland Chinese OSATs leverage mature-node expansions to infiltrate edge AI server markets. Over the next 12–24 months, only firms with heterogeneous integration capabilities and geopolitical neutrality will survive the coming supply chain consolidation; others face ejection from the AI hardware core ecosystem.