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AI’s Biggest Bottleneck Could Make These 2 Stocks Soar - The Globe and Mail

www.theglobeandmail.com 2026-05-29 The Globe and Mail
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AI chipsPower management ICs800V platformData centersElectric vehiclesAnalog semiconductorsTexas InstrumentsonsemiPower architectureSemiconductor investmentAI infrastructureEnergy efficiency
News Summary
While the AI boom captures headlines for its computational power, the real bottleneck lies in the power delivery infrastructure that supports these chips. As data centers and electric vehicles demand ... Read original →
Industry Analysis
The AI compute race is hitting a power wall—800V adoption isn’t just upgrading voltage rails; it’s elevating PMICs from ancillary parts to critical bottlenecks. Technically, NVIDIA must co-design high-density power delivery with Texas Instruments, while onsemi leverages its SiC vertical integration to dominate fast-charging and server power systems. Geopolitically, U.S.-EU supply chain anxieties accelerate onshore capacity builds, yet reliance on foundries in Taiwan, China and mainland China remains a latent vulnerability. Competitors like Infineon and STMicroelectronics are scrambling via analog acquisitions but lack TI’s system-level power architecture moat. Over the next 12–24 months, the 800V supercycle will double analog content per system, especially in AI clusters and premium EVs, granting TI and onsemi expanding pricing power and margins as the overlooked ‘gatekeepers of AI power infrastructure.’
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