AI Demand Will Keep DRAM Market Under Pressure

The ongoing surge in AI infrastructure investment is driving unprecedented supply shortages in the global DRAM market. Unlike previous cycles driven by PC and smartphone demand, today's DRAM boom is p... Read original →

The explosive growth of AI infrastructure is reshaping the DRAM market, extending its impact beyond data centers to robotics and physical AI. Technologically, surging demand for high-bandwidth memory (HBM) and advanced DRAM has intensified bottlenecks in packaging and node capacity, triggering upstream supply chain disruptions. From a compliance perspective, geopolitical tensions are exacerbating risks in global semiconductor supply chains, particularly as key production capacities are concentrated in Taiwan, China, and Hong Kong, China. Companies may respond with phased capacity expansion and strategic partnerships with AI firms, accelerating industry consolidation. Over the next 12 to 24 months, the DRAM market will remain under pressure, especially in HBM and advanced packaging segments, unless significant technological breakthroughs or accelerated capacity deployment occur.