AI demand reshapes memory cycle as Micron projects post-2027 shortage - CHOSUNBIZ - Chosunbiz

The traditional semiconductor memory cycle is being reshaped by the rise of artificial intelligence. Micron Technology forecasts continued tight supply-demand conditions beyond 2027, driven by AI-led ... Read original →

AI-driven memory demand is shifting from consumer electronics’ cyclical volatility to data centers’ structural tightness, fundamentally rewriting DRAM and NAND market dynamics. Technologically, HBM has evolved beyond a commodity—its 3D stacking and TSV processes compel upgrades across equipment, materials, and advanced packaging, raising the entire supply chain’s technical barrier. On compliance, tightening U.S.-EU export controls on advanced tools, combined with sub-3nm yield challenges, will inflate CapEx and geopolitical exposure for Samsung, SK hynix, and Taiwan, China-based players. Strategically, Samsung is fast-tracking HBM4 and expanding Pyeongtaek capacity to reclaim NVIDIA share lost to SK hynix, while Micron locks in hyperscalers via bespoke, multi-year deals. Over the next 12–24 months, persistent HBM shortages will sustain premium pricing—but co-packaged optics and in-memory computing could soon disrupt this equilibrium, making today’s aggressive expansions vulnerable to future obsolescence.