Advanced Packaging Technologies Market to Surge Beyond $15 - GlobeNewswire

The global advanced packaging technologies market is projected to surge beyond $15 billion by 2030, growing from $8.03 billion in 2025 to $9.18 billion in 2026 at a CAGR of 14.2%. This expansion is dr... Read original →

Advanced packaging is shifting from a supporting role to the epicenter of semiconductor performance breakthroughs. The maturation of 3D IC stacking and hybrid bonding is triggering a cascade effect—forcing EDA tools, TSV etching equipment, and thermal interface materials to evolve rapidly. Geopolitical friction is accelerating localized investments by TSMC (Taiwan, China), Samsung, and Japanese peers, yet U.S. CHIPS Act subsidies come with stringent supply chain audits that inflate compliance costs. Samsung and Intel are vertically integrating through acquisitions like BE Semiconductor, while Qualcomm bets on SiP to sidestep advanced-node constraints. Over the next 18 months, AI chip demand will ignite a capacity race in fan-out wafer-level packaging, with Taiwan, China and South Korea likely achieving 2.5D/3D scale first—but U.S.-China tech decoupling will keep disrupting equipment logistics and talent flows, compelling redundant supply chains.