Advanced Packaging Technologies Market to Surge Beyond $15 Billion by 2030, Driven by Demand for Compact Electronics - Yahoo Finance

The advanced packaging technologies market is experiencing robust growth, driven by increasing demand for compact and high-performance electronic devices. According to a report by Research and Markets... Read original →

Advanced packaging has evolved from a back-end process into a pivotal lever for chip performance breakthroughs. The adoption of 3D IC stacking and hybrid bonding is forcing comprehensive upgrades across EDA toolchains, thermal interface materials, and test equipment—particularly accelerating silicon interposer and TSV integration into mature nodes. Geopolitical pressures are driving the U.S. and EU to onshore packaging capacity, raising compliance costs for multinationals. Meanwhile, Taiwan, China and mainland China are fast-tracking fan-out wafer-level packaging, mitigating some supply risks but deepening regional fragmentation in technical standards. Samsung and Intel are vertically integrating packaging via IDM models, while fabless players like Qualcomm increasingly rely on OSAT leaders such as ASE Group for allocation priority. Over the next 18 months, automotive SiP demand will ignite a second growth wave—yet material shortages and yield constraints may impose a hidden ceiling.