A delegation from Purdue University visited the Ministry of Economic Affairs, planning to collaborate with GQ to create a third-generation semiconductor and AI innovation ecosystem between Taiwan and the United States - Purdue Research Foundation

A delegation from Purdue University recently visited Taiwan's Ministry of Economic Affairs and Ministry of Education to deepen cooperation between Taiwan and the United States in science, technology, ... Read original →

This Purdue-GQ partnership is a strategic move by the U.S. to fortify its 'trusted semiconductor supply chain' amid tech decoupling. Technically, integrating SiC with AI-driven thermal management will accelerate high-power devices toward 800V+ platforms, pressuring TSMC and UMC to fast-track wide-bandgap integration. On compliance, while framed as academic collaboration, any sharing of MOSFET/IGBT design tools or epitaxy equipment could trigger BIS scrutiny, raising operational costs for firms like GCL. Competitors like Infineon and Wolfspeed will likely counter by expanding Southeast Asian fabs and locking in Japanese/Korean clients via cross-licensing. If a vehicle-grade SiC module emerges within 18 months, Taiwan, China could shift from contract manufacturing toward standards influence—provided the U.S. excludes this initiative from CHIPS Act restrictions.