Industry Analysis
The EU Chips Act 2.0’s formal embrace of photonics is a strategic move to break AI compute bottlenecks. Technologically, co-packaged optics and silicon photonics will drive urgent SOI wafer capacity expansion—locking in Soitec and Siltronic’s dominance—while forcing foundries like X-FAB to rapidly master heterogeneous integration. Compliance-wise, subsidies come with strings: mandatory localization thresholds and tech sovereignty audits will inflate operational overhead. In response, the U.S. may accelerate joint R&D through IMEC alliances, while Taiwan, China’s fabless ecosystem risks exclusion due to weak domestic PIC infrastructure. Over the next 12–24 months, photonic integrated circuits will shift from optional to mandatory in AI data centers. By anchoring pilot lines and design automation standards now, Europe isn’t just subsidizing hardware—it’s capturing architectural control over next-gen interconnects.
This page displays AI-generated summaries and metadata for research purposes. Original content belongs to the respective publishers.