SemiPulse — Semiconductor Intelligence

Key Takeaways:Chiplet design turns semiconductor development into a system-level problem, requiring coordinated workflows across design, packaging, verification, test, and reliability.Successful chiplet workflows must handle multi-physics challenges — especially thermal, mechanical, power, and signal integrity — early enough to reduce costly failures before assembly and tape-out.AI is beginning to

Chiplets System-level design Advanced packaging Multi-physics simulation AI in semiconductor design Thermal management Signal integrity Mechanical integrity

Baader Bank Aktiengesellschaft Purchases 5,517 Shares of Taiwan Semiconductor Manufacturing Company Ltd. $TSM - MarketBeat

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www.marketbeat.com 2026-05-14 MarketBeat

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Ameritas Advisory Services LLC Lowers Stock Holdings in Taiwan Semiconductor Manufacturing Company Ltd. $TSM - MarketBeat

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www.marketbeat.com 2026-05-14 MarketBeat

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AI to drive semiconductor growth to US$1.5 trillion by 2030: TSMC - Focus Taiwan

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focustaiwan.tw 2026-05-14 Focus Taiwan

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Hua Hong Semiconductor: Revenue up 22.2% YoY and net profit attributable to shareholders surged 458.1% - TradingView

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www.tradingview.com 2026-05-14 TradingView

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We're enjoying the semiconductor boom and relatively comfortable despite rising costs: Resonac CEO - CNBC

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news.google.com 2026-05-14 CNBC

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India's nascent semiconductor sector faces China's push in older chips - Nikkei Asia

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asia.nikkei.com 2026-05-14 Nikkei Asia

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The Unresolved Challenges in U.S.–India Semiconductor Cooperation - Carnegie Endowment for International Peace

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carnegieendowment.org 2026-05-14 Carnegie Endowment for International Peace

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The Semiconductor Upcycle Is Being Driven by Memory Pricing, Not Unit Growth - 24/7 Wall St.

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247wallst.com 2026-05-14 24/7 Wall St.

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Wall Street Is Worried About a 'Sizzling' Semiconductor Trade. History Says Cooling Periods Like This Set Up the Next Leg Higher - 24/7 Wall St.

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247wallst.com 2026-05-14 24/7 Wall St.

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MediaTek courts Intel as Google pushes for alternatives to CoWoS

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digitimes.com 2026-05-14

MediaTek's decision to pursue advanced packaging partnerships with both TSMC's CoWoS ecosystem and Intel's EMIB platform has become one of the semiconductor industry's most closely watched strategic moves.

China's semiconductor godfather warns against 2nm fixation

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digitimes.com 2026-05-14

While the global semiconductor industry remains fixated on 3nm, 2nm, and the AI GPU arms race, SMIC founder and "China's semiconductor godfather" Zhang Rujing is pushing a sharply different message: the future of China's chip industry may depend less on chasing the world's most advanced nodes and more on dominating the vast market still built on mature processes.

Korea races to narrow chip packaging gap with Taiwan and China

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digitimes.com 2026-05-14

AI server demand is pushing semiconductor packaging into a new growth cycle, but the market remains heavily concentrated among a small group of global outsourced semiconductor assembly and test leaders and Taiwanese and Chinese companies, sharpening the challenge for South Korea's back-end chip industry.