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2026-04-17
EU DARE Project Is Scrambling to Replace Codasip
0.87
eetimes.com
2026-04-17
Pablo Valerio
EU DARE project explores alternatives after Codasip divestment creates uncertainty around roadmap and architectural direction.
EU Semiconductor Initiative
DARE Project
RISC-V Architecture
European Supercomputing
Semiconductor Supply Chain
Secure Chips
EDA Tools
European Tech Sovereignty
2026-04-07
What’s Failing At The Interface
0.92
semiengineering.com
2026-04-07
Gregory Haley
In advanced packages, the interface is where problems show up, but rarely where they be...
Advanced Packaging
Interface Failure
Semiconductor Testing
Wafer Level Testing
Package Structure
Material Interface
Interconnect Technology
Test Chain
2026-03-18
One Billion Cellular IoT LPWAN Connections
0.92
eetimes.com
2026-03-18
Pablo Valerio
Enabling IoT LPWAN scalability and security for future connectivity with NB-IoT, LTE-M, eREDCAP, and upcoming 6G networks.
IoT
LPWAN
NB-IoT
LTE-M
5G
eSIM
iSIM
GSMA
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