SemiPulse — Semiconductor Intelligence

Moore Threads has entered a strategic partnership with Lightwheel Intelligent (Beijing) Technology (Lightwheel.ai) to jointly develop a domestic simulation and synthetic data infrastructure platform for embodied AI, highlighting China's broader push to reduce reliance on foreign AI computing and robotics software ecosystems.

TSMC adds four executives in latest reshuffle as US investment and succession push accelerate

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digitimes.com 2026-05-13

TSMC's board of directors approved a US$31.3 billion capital budget on May 12 for advanced-process capacity buildout, factory construction, and fab infrastructure — and separately approved a capital injection of up to US$20 billion into its wholly owned US subsidiary, TSMC Arizona.

Ableprint posts record first-quarter profit as CPO orders set to begin in June

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digitimes.com 2026-05-13

Ableprint reported record first-quarter 2026 revenue and profit as customers installed and qualified new advanced packaging production lines and expanded shipments of high-end process equipment, with the company saying demand tied to co-packaged optics started to convert into orders. The firm posted net profit after tax of NT$415 million, up 82.1% year on year, and first-quarter revenue rose 81.9%

Samsung Foundry comeback takes shape—AI chips, HBM4 lift 4nm demand

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digitimes.com 2026-05-13

Samsung Electronics' foundry business is showing signs of recovery after a prolonged downturn, as AI chip projects and HBM4-related demand begin to raise utilization at its advanced-process lines.

ChipMOS 1Q26 earnings jump 186% on strong packaging and testing demand

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digitimes.com 2026-05-13

Taiwanese outsourced semiconductor assembly and test (OSAT) services company ChipMOS Technologies reported strong growth in both revenue and profit for the first quarter of 2026. Net profit after tax for the quarter reached NT$505 million (approx. US$16.03 million), up 1% from the previous quarter and 186.37% from a year earlier, while earnings per share (EPS) came to NT$0.72, the highest in the p

Imec's IC-Link joins TSMC 3DFabric Alliance, extending 3D integration access worldwide

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digitimes.com 2026-05-13

Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI, high-performance computing, automotive, and telecommunications markets worldwide—as well as techn

Intel's preliminary Apple deal puts Samsung's foundry ambitions under pressure

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digitimes.com 2026-05-13

Intel's reported preliminary agreement to manufacture some chips for Apple is putting new pressure on Samsung Electronics, as the US chipmaker gains momentum with major technology customers and leans on Washington's support to revive its foundry business.